The advanced packaging race
CoWoS, EMIB, SoIC. Why the assembly line became the new fab.
§ 07 · Aggregated feed · External
What everyone else is saying.
Every relevant article we've indexed on AI memory and HBM supply this week, headline-only, one click to the source. No paraphrasing, no summaries.
May 12 · 11:42SK Hynix says HBM4 will be on track despite reports of customer specification changesReuters↗May 12 · 09:18Inside NVIDIA's quiet pivot to Samsung HBM3E qualificationThe Information↗May 11 · 22:05Microsoft, Micron strike long-term memory supply deal — terms undisclosedBloomberg↗May 11 · 17:30Cerebras WSE-4 GA brings wafer-scale inference within reach of mid-size buyersThe Register↗May 11 · 14:12Why CoWoS is the new "wafer" — and TSMC knows itSemiAnalysis↗May 10 · 19:48Lightmatter raises Series E at $4.4B; co-packaged optics shipping to hyperscalersTechCrunch↗May 10 · 12:04Commerce Department issues guidance on HBM3E export controlsFinancial Times↗May 09 · 21:55DeepSeek V4 paper claims 2× inference throughput at iso-qualityarXiv↗May 09 · 15:21Intel Foundry's first external HBM packaging customer is reportedly AWSSemiAnalysis↗May 09 · 08:33Why every AI training run is now a packaging negotiation.Stratechery↗
12 sources · 41 new this weekOpen the full feed →